| Series |
5804 |
| No. of Positions |
10 to 80 |
| Stacking Height |
0.9mm |
| Pitch |
0.4mm |
| Rated Current |
DC 0.3A Max./Contact |
| Rated Voltage |
DC 50V/Contact |
| Withstanding Voltage |
AC 250Vrms/min. |
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 Outline |
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| Series 5804 is a 0.4mm pitch and ultra low profile Board to Board connector with 0.9mm in mating height is developed to meet marketing needs for minimum size of cell phones, digital AV equipment, etc. A great deal of space saving is achieved with 2.4mm in width. |
| Features |
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| (1) |
A great deal of space saving is achieved on a PCB. 0.9mm in mating height and 2.4mm in width.
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| (2) |
Pattern can be laid out between connector leads, which is suitable for high density package, because no metal is exposed on the bottom of the connector besides its slim and low profile. |
| (3) |
Double-sided contact structure is adopted to enhance the resistance to vibration or drop shock. The Twin-rib structure that is employed for the shape of contact on plug side, which eliminates foreign obstacles such as splash of the flux, chips of boards separation and so on, and ensures the high contact reliability. |
| (4) |
Original locking structure is adopted for mating lock mechanism that realizes the firm clicking response and enhances the retention force when connectors unmated even with their low profile. |
| (5) |
Connectors exclusively for circuit check are available for use in the mounting process. |
| (6) |
Packaged in tape and reel: 3,000 pieces/reel. |
| (7) |
RoHS compliant product. |
| (8) |
Plating Specifications |
| Plating Code |
Contact Area |
Tail Area |
RoHS Compliance |
| 829+ |
Au(0.1 to 0.3µm) |
Au(0.03 to 0.15µm) |
Yes |
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| Related link |
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Japanese
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