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KYOCERA Corporation
Products > Product Type > Board to Board Connectors > 5061/5072 Series  Japanese Chinese

5061/5072 Series

  1.27mmPitch Right Angle-Right Angle Vertical-Vertical
  Right Angle-Vertical Vertical-Right Angle
  SMT/Through Hole With or Without metal tab Type

Series 5061/5072
No. of Positions 20 to 200
Stacking Height 12,12.5,13,14,15,16
17,18,19,20,22,24mm
Pitch 1.27mm
Rated Current AC/DC 0.5A
Rated Voltage AC/DC 250V
Withstanding Voltage AC 650Vrms/min.
5061/5072 Series

Outline
The Microleaf connector is 1.27mm spacing two-piece board to board connector.
The leaf style design provides two points of contact with a positive snap-action and an audible click when fully engaged. The plugs of the 5072 series are compatible with a receptacle of the 5061 series. Owing to the development of new contacts, the insertion force required for mating has been decreased by approximately by 10% in comparison with the conventional 5061 plugs, and as many as 200 contacts have been achieved. This makes a long mating length and sequential contacts possible.

Features
(1) Contact Material: Copper Alloy
(2) Insulator Material: Heat resistance plastic
(3) Operating Temperature Range: -55 to +85°C
(4) Plating Specifications
Series 5061
Plating Code Contact Area Tail Area Metal tab RoHS Compliance
828+ Au(0.38µm Min.) Sn-Cu - Yes
833+ Au(0.05µm Min.),Pd-Ni Sn-Cu - Yes
856+ Au(0.1µm Min.) Sn-Cu Sn-Cu Yes
- Yes
861+ Au(0.25µm Min.) Sn-Cu - Yes
863+ Au(0.76µm Min.) Sn-Cu - Yes
871+ Au(0.5µm Min.) Sn-Cu - Yes

Series 5072
Plating Code Contact Area Tail Area RoHS Condition
833+ Au(0.05µm Min.),Pd-Ni Sn-Cu Yes
856+ Au(0.1µm Min.) Sn-Cu Yes
861+ Au(0.25µm Min.) Sn-Cu Yes
863+ Au(0.76µm Min.) Sn-Cu Yes
871+ Au(0.5µm Min.) Sn-Cu Yes

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 Related link
5061/5072 Series Catalog Drawing
(pdf/602KB)PDF
Pin counts? (5061)
Pin counts? (5072)
Check the Parts No. of Availability products, RoHS condition or Minimum packaging quantity.

Environmental Correspondence

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